For removing resin fluxes, unsoldered solder pastes on assembled and unassembled boards/hybrids, solder frames, electronic components and assemblies. When used properly, fast and gentle cleaning is ensured.
TICKOPUR TR 14 removed:
Resin fluxes, solder pastes, ionic and non-ionic residues, drilling and grinding residues, fingerprints, greases and oils
Parts made of metal, glass, ceramics, plastic, rubber, assembled and unassembled printed circuit boards, solder frames, electronic components and assemblies etc.
Resin fluxes are preferably removed by saponification with the formation of water-soluble resin soaps. This process is considerably supported by ultrasonic application. TICKOPUR RW 77 should be used for cleaning printed circuit boards in the service area.
- For ultrasound application
- pH 11.7 at 1 %
- Free from organic solvents
- Surfactant-free - non-foaming
Application concentration for application with ultrasound
Dosage: 10 %
PA time: 30 - 180 seconds
Temperature: 60 - 70 °C
TICKOPUR TR 14 is suitable for all materials. Alkali and water-sensitive components may be attacked. Preliminary tests on the resistance of these parts are recommended.
H318 Causes serious eye damage.
H315 Causes skin irritation.
P280 Wear protective gloves/protective clothing/eye protection/face protection.
P305+P351+P338 IF IN EYES: Rinse cautiously with water for several minutes.
Remove existing contact lenses if possible. Continue rinsing.